Job title: Miniaturization Engineer
Job type: Permanent
Emp type: Full-time
Industry: Semiconductors
Expertise: Engineering Semiconductor / Embedded Device
Location: Quezon City
Job published: 2022-04-05
Job ID: 34623

Job Description

KEY RESPONSIBILITIES:

You will:

  • Research and establish the applicability of new device package technologies (e.g. flip-chip, chip-on-board, etc.) and high power density magnetics to our products and applications
  • Help introduce the most promising packaging technologies into our designs, considering amongst others:
    • Internal and supplier capabilities
    • Cost and manufacturing processes
    • Automation, testability and reliability
  • Study new or novel thermal management techniques suited to our high-power density products and applications
  • Conduct concept analyses and the complete mechanical design and test of prototypes
  • Successfully transition new and proven technologies into the design teams and support products into production with design reviews and problem-solving skills

QUALIFICATIONS & REQUIREMENTS:

  • Bachelor’s degree in Electronics and Communications Engineering, Electrical Engineering or Mechanical Engineering
  • 8 or more years work experience including exposure to at least some of the following areas applied to power conversion devices and/ or electronic systems:
    • MEMS/ Miniaturisation
    • Electronics packaging
    • Research and development
    • Thermal management
    • Reliability
    • Severe operating environments (shock, vibration, temperature, altitude, contaminants)
    • Reliability
    • Simulations tools
  • Experiences in using CAD, Electronic Systems Packaging, Thermal Management, and BoM preparation and cost estimate will be an added advantage
  • Good verbal and written communication skills

Work Schedule: Monday-Friday, Regular Day shift

Work Setup: Onsite