Job Description

KEY RESPONSIBILITIES:

You will:

• Research and establish the applicability of new device package technologies (e.g. flip-chip, chip-on-board, etc.) and high power density magnetics to our products and applications
• Help introduce the most promising packaging technologies into our designs, considering amongst others:
  • Internal and supplier capabilities
  • Cost and manufacturing processes
  • Automation, testability and reliability
• Study new or novel thermal management techniques suited to our high-power density products and applications
• Conduct concept analyses and the complete mechanical design and test of prototypes
• Successfully transition new and proven technologies into the design teams and support products into production with design reviews and problem-solving skills

QUALIFICATIONS & REQUIREMENTS:

• Bachelor’s degree in Electronics and Communications Engineering, Electrical Engineering or Mechanical Engineering
• 8 or more years work experience including exposure to at least some of the following areas applied to power conversion devices and/ or electronic systems:
  • MEMS/ Miniaturisation
  • Electronics packaging
  • Research and development
  • Thermal management
  • Reliability
  • Severe operating environments (shock, vibration, temperature, altitude, contaminants)
  • Reliability
  • Simulations tools
• Experiences in using CAD, Electronic Systems Packaging, Thermal Management, and BoM preparation and cost estimate will be an added advantage
• Good verbal and written communication skills

Work Schedule: Monday-Friday, Regular Day shift

Work Setup: Onsite